• Boardcon Announces EM1808 Embedded SBC for AIoT Solution

  [2020-03-03]

• Boardcon Releases Idea3288 SBC for Intelligent Devices

  [2019-12-23]

• Boardcon announced a SBC powered by NXP’s i.MX8M Mini

  [2019-10-22]

• Samsung 12-Layer 3D-TSV Chip Packaging Technology

  [2019-10-08]

• Samsung launches its first 5G-integrated mobile chipset Exynos 980

  [2019-09-09]

• China, Russia to promote compatibility of BeiDou and GLONASS navigation systems

  [2019-09-01]

• Arm unveiled the next-generation AI experiences for 5G world

  [2019-07-28]

• Boardcon launched a MT6737 module features GPS + WiFi + BT + 3G/4G

  [2019-07-28]

• Samsung Begins Mass Production of Industry’s First 12Gb LPDDR5 Mobile DRAM

  [2019-07-25]

• Boardcon Launches a RK3399 SBC Targeting AI Applications

  [2019-03-14]

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